Our main products, the substrate materials for smart cards, serve as the carrier material for smart cards, supporting and protecting the internal microchips, printed layers, protective overlay layers, etc. The card base material needs to meet the complex post-processing requirements such as printing, winding, slotting, heat sealing, punching, embossing characters, etc. for smart cards.Therefore, it is required to have strict requirements for more than ten indicators such as thickness, specification size, roughness, glossiness, Vicat softening point temperature, color difference, thermal expansion rate, whiteness, flatness, light transmittance, tensile strength, density, and impact strength.
Our company is an enterprise that has been engaged in the research and development, production, and operation of smart card substrate materials for a relatively long time. We have accumulated rich technical experience in the field of card substrates. We have formed a series of smart card substrate products such as PETG, ABS, PC, and bio-based materials, achieving differentiated production of smart card substrates. We keep up with the rapid development and technological updates in the smart card industry, and our products are widely used in the production of various types of smart cards such as identity cards, bank cards, social security cards, transportation cards, and communication cards, occupying a relatively high market share in the high-end market of smart card substrates.
A series of card substrate materials of PETG, ABS, PC, and bio-based materials are mainly used as carrier materials for various smart cards, including protective layers, printed layers, INLAY layers, etc. for various smart cards.
