The traditional production of PC card base films relies on the high-temperature laminating process of 175-190°C, which is energy-intensive and leads to significant equipment wear and tear. This has become a key bottleneck restricting the popularization of PC cards. SZIMAGE recently introduced a low-temperature laminating process (150°C), combined with its independently developed nano-composite adhesive. Under the premise of ensuring the ISO 7810 standard peel strength (≥1.5N/mm), the energy consumption has been reduced by 30%, production efficiency has increased by 15%, and production costs have been cut by approximately 20%. This technology has been applied to the Indian Electronic Citizen Card project. The cost of a single card has dropped from $0.8 to $0.65, promoting the rapid penetration of PC cards in developing countries. In the future, the low-temperature process may be combined with PC card films to further enhance environmental protection and cost advantages.
